MC74HC157A |
RFQ for MC74HC157A Required Field |
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| Technical/Catalog Information | MC74HC157ADG |
| Vendor | ON Semiconductor |
| Category | Integrated Circuits (ICs) |
| Circuit | 4 x 2:1 |
| Independent Circuits | 1 |
| Mounting Type | Surface Mount |
| Current - Output High, Low | 7.8mA, 7.8mA |
| Package / Case | 16-SOIC (3.9mm Width) |
| Packaging | Tube |
| Type | Data Selector/Multiplexer |
| Voltage Supply Source | Single Supply |
| Operating Temperature | -55°C ~ 125°C |
| Voltage - Supply | 2 V ~ 6 V |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MC74HC157ADG MC74HC157ADG MC74HC157ADGOS ND MC74HC157ADGOSND MC74HC157ADGOS |
| Product | Manufacturers | Pack | D/C |
| MC74HC157A | - | - | 2000 |
| Symbol | Parameter | Value | Unit |
| VCC | DC Supply Voltage (Referenced to GND) | 0.5 to + 7.0 | V |
| Vin | DC Input Voltage (Referenced to GND) | 0.5 to VCC + 0.5 | V |
| Vout | DC Output Voltage (Referenced to GND) | 0.5 to VCC + 0.5 | V |
| Iin | DC Input Current, per Pin | ±20 | mA |
| Iout | DC Output Current, per Pin | ±25 | mA |
| ICC | DC Supply Current, VCC and GND Pins | ±50 | mA |
| PD | Power Dissipation in Still Air,Plastic DIP† SOIC Package† TSSOP Package† |
750 500 450 |
mW |
| Tstg | Storage Temperature | 65 to + 150 | C |
| TL | Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC or TSSOP Package) |
260 | C |
